About RJMICRO
Automotive-grade, high-reliability sensing and control chip solutions。We are committed to localizing sensing and control chips for automotive powertrain and chassis, contributing to the self-reliance of China’s automotive industry.
Company overview
Zhejiang Ruijing Microelectronics Co., Ltd. (RJMICRO) was founded in November 2023 by automotive-focused industrial investors together with senior semiconductor experts, with a registered capital of CNY 57.75 million. The company headquarters are in Dream Park, Taizhou Bay New Area, Zhejiang, while its R&D and operations centre is in Tengfei Innovation Park, Dushu Lake Science and Innovation District, Suzhou Industrial Park.
RJMICRO has a complete in-house team covering automotive chip development through volume production. The core team brings together chip design, algorithm, application and engineering experts from leading semiconductor companies as well as automotive electronics specialists, with rich experience taking automotive chips from zero to one and into volume delivery.
By coupling tightly with upstream and downstream partners we substantially shorten the development cycle of traditional automotive chips, and we customize products around real application requirements — achieving more efficient localization and a clearly stronger competitive position.
Positioning: Serving the automotive, energy, industrial and appliance markets, we develop high-reliability, highly integrated MCU/SOC devices, sensors and power driver chips for controllers, actuators and sensing — meeting the evolving demands of vehicle electrification and intelligence. Our goal is to become a leading and trusted automotive chip and solution supplier in China.
Founded
November 2023
Registered capital
CNY 57.75 million
Our team
A complete automotive chip development team, with over 50% holding a master’s degree or above and deep R&D, engineering and productization experience.
R&D strength and three technology pillars
Our core R&D covers magnetic sensing elements, analog signal chains and SOC integration — a complete capability chain from device and process to system integration.
Mixed-signal SOC design
Automotive-grade mixed-signal design that integrates digital and analog circuits efficiently, complemented by hardware/software algorithm integration for complex automotive electronic systems.
High-voltage BCD process design
Deep expertise in high-voltage BCD (Bipolar-CMOS-DMOS) technology, balancing high voltage, high current and low power consumption.
Sensor devices and process
Magnetic sensor process know-how across the whole chain from device design to process implementation, ensuring high performance and reliability.
Magnetic sensing elements
In-house development of core sensing devices, combining TMR, IMC flux concentrators and Hall technology.
Analog signal chain
High-precision signal processing covering amplification, chopping, temperature compensation and calibration.
SOC devices
System-on-chip integration that brings MCU, power, driver and communication interfaces into a single die.
Standardized development process and volume production
With a complete in-house automotive chip team and full zero-to-one development experience, we cover design verification, algorithms and software, package qualification and test. Our IPD-based development management system ensures successful delivery.
Fast time to market
Tightly coupled upstream/downstream development substantially shortens the traditional automotive chip cycle and enables efficient localization.
30-50%shorter development cycle
Custom development
- Custom development driven by application requirements
- Chip performance and features optimized for each customer’s scenario
- Flexible feature configuration that clearly strengthens competitiveness
Supply chain integration
Strategic collaboration across the supply chain forms a full-process mechanism from chip definition to system integration.
OEMs
Close collaboration with leading automotive customers, with a deep understanding of their requirements and use cases.
Tier 1 suppliers
A tight co-development mechanism with Tier 1 suppliers, covering chip definition through system integration.
Foundries
Strategic partnerships with leading automotive-grade foundries secure capacity and advanced process technology.
Assembly and test
Deep cooperation with leading automotive packaging and test houses safeguards quality and reliability.
Long-term strategy
To localize sensing and control chips for automotive powertrain and chassis, becoming a leading and trusted automotive semiconductor supplier in China.
Our path
Keep investing in R&D
Broaden the product portfolio and deepen technical strength.
Expand application coverage
From powertrain and chassis toward ADAS and body electronics.
Strengthen ecosystem collaboration
Build an open, mutually beneficial ecosystem.
Value proposition
Safer
High functional-safety design that protects driving safety.
Smarter
Enabling intelligent functions that improve the driving experience.
More efficient
Better energy efficiency and lower system cost.
Our mission
We empower the electrification and intelligence of vehicles with safer, smarter and more efficient chip-level solutions.
Let’s advance China’s automotive chip industry together
Whether you are an OEM, a Tier 1 or a design house, talk to us about product definition, application validation and supply chain collaboration.